
Senior Wafer Bumping Process Specialist
6 days ago
As a seasoned NPI Engineer, you will be instrumental in driving new product introductions, ensuring process integration, and supporting cross-functional collaboration to meet technical and quality expectations.
Key Responsibilities:
- Lead and manage end-to-end project activities, from customer engagement to project closure, ensuring timely and efficient execution.
- Maintain detailed documentation across project phases including Kick-off, Engineering Builds, Qualification, and Mass Production.
- Analyze customer specifications related to materials, processes, and assembly; identify gaps or discrepancies and drive internal review discussions.
- Develop detailed project timelines, track milestones, resolve potential issues, and maintain alignment with internal stakeholders and customers.
- Monitor key project indices and organize regular reviews to assess team performance and drive continuous improvement.
- Support team capability building in project management, adaptability, and crisis resolution.
- Drive productivity enhancement and cost optimization through process integration initiatives.
Ideal Requirements:
- Degree or Diploma in Electrical/Electronics Engineering or a related field.
- Minimum 3 years of experience in semiconductor manufacturing, preferably in NPI project roles.
- Project Management Certification is an advantage.
- Hands-on experience in wafer bumping processes including lithography, sputtering, etching, plating, descum, and ball drop.
- Familiarity with WLCSP bumping processes (e.g., 2P2M), and quality tools such as DOE, SPC, FMEA, JMP, and APQP.
- Strong understanding of how materials and processes interact to influence package reliability and performance.
- Excellent communication, coordination, and problem-solving skills to work across departments and with external partners.
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