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Semiconductor Manufacturing Process Lead

3 weeks ago

Singapore beBeeProductIntroduction Full time $80,000 - $120,000
Job Description:

We are seeking a highly experienced Product Introduction Specialist to lead our New Product Introduction (NPI) process from concept to mass production. The ideal candidate will have a strong background in semiconductor manufacturing processes, electronic testing, and automotive electronic qualification requirements.

The successful candidate will be responsible for leading the NPI process, developing and implementing package development, assembly, and testing for new Power Management IC (PMIC) products for the automotive industry. They will identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.

  • Lead the NPI process from concept to mass production at OSAT, with a focus on Quad Flat Package (QFP) and Ball Grid Array (BGA).
  • Develop and implement package development, assembly, and testing for new PMIC products for the automotive industry.
  • Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
  • Ensure manufacturability and product ramp-up.
  • Prepare and present reports on NPI project status, risks, and milestones.
  • Drive failure analysis to identify root causes for issues.
  • Perform risk assessments such as failure mode and effects analysis.
  • Develop, align, and monitor qualification processes.
  • Interface with the Quality Department for quality confirmation.
  • Elaborate and define data exchange between OSAT and Continental for traceability, quality assurance, and yield monitoring.
  • Establish part traceability concepts.
  • Conduct risk assessments and implement mitigation strategies.
Required Skills and Qualifications:
  • Bachelor's degree in Electronics/Electrical Engineering or relevant field with a minimum of five years' experience in semiconductor manufacturing, subcon management, or related fields.
  • Good knowledge of semiconductor manufacturing processes, electronic testing, and automotive electronic qualification requirements.
  • Strong technical proficiency in package and assembly processes.
  • Excellent interpersonal and communication skills, with the ability to interact with internal and external stakeholders.
  • Strong problem-solving skills, results-oriented, and a quality-focused mindset.
  • Team player with a proactive attitude, able to work independently and travel frequently.
Benefits:

This is a challenging and rewarding role that offers the opportunity to work with a talented team and contribute to the success of our company. We offer a competitive salary and benefits package, including health insurance, retirement plan, and paid time off. We also provide opportunities for professional growth and development, as well as a dynamic and inclusive work environment.