
High Speed Signal Integrity Specialist
7 days ago
The ideal candidate will be responsible for the successful delivery of products through SI/PI signoff of chip design, package design and PCB design. This includes modeling high speed I/O and PDN, customer support for PCB design signoff and issue debug, product electrical specifications related to high speed I/O and EMC issues.
- Primary Responsibilities (70%):
- Responsible for SI/PI signoff of chip design, package design and PCB design.
- Responsible for modeling high speed I/O and PDN.
- Responsible for customer support for PCB design signoff and issue debug.
- Secondary Responsibilities (30%):
- Responsible for product electrical specifications related to high speed I/O.
- Responsible for modeling and simulation of EMC issues.
Requirements:
- 10+ years of working experience in SI/PI
- Deep understanding of electromagnetic theory, transmission line theory and microwave theory
- Familiar with SI/PI design flow, time domain and frequency domain modeling and simulation
- Good comprehension of PLL, equalization, CDR, jitter, noise, IBIS modeling, 8b10b encoding
- Hands on experience with lab equipment such as the high speed oscilloscope, spectrum analyzer and network analyzer
- Skilled with SI/PI simulation tools from ANSYS, Cadence, Keysight and others.
- Skilled in data processing with script in Python, Matlab or other languages.
- Experience in MIPI D-PHY, C-PHY and PAM-4 is a plus.
- Good communication skills and team work.
- Education: MS/PhD
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