Senior Engineering Specialist in Wafer Bonding and Stacking

Die Stacking and Packaging Technology ExpertWe are seeking an expert in die stacking and packaging technology to join our Advanced Packaging Technology Development team. The ideal candidate will have a deep understanding of process flows, interactions, and how changes can affect yield, performance, and reliability.The role involves developing and optimizing...

Job DescriptionThe Advanced Packaging Development Center (APDC) is a state-of-the-art cleanroom and among the most advanced wafer-level packaging labs globally. We are seeking an experienced Plasma Technology Development Process Engineer to join our team. Key Responsibilities:Improve current plasma activation technology for hybrid bonding and develop...

Advanced Packaging EngineerWe are seeking an experienced engineer with expertise in advanced packaging processes and technologies, including hybrid bonding, chip-level and wafer-level packaging, 2.5D/3D integration and assembly.This role requires a Master's Degree or PhD in a related discipline and at least 8-10 years of experience in semiconductor equipment...

About the CompanyMicron Technology, Inc. is a leading innovator in memory and storage solutions that transform how the world uses information to enrich life for all. We deliver high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands.Main Responsibilities:Develop and optimize advanced packaging equipment for...

Key Responsibilities Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements. Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding...

Equipment Performance Improvement SpecialistJob Description:We are seeking a skilled Equipment Performance Improvement Specialist to lead efforts to enhance equipment performance, reliability and efficiency within the Wafer Finishing manufacturing process.Main Responsibilities:Manage a team of equipment technicians, overseeing fault investigations and...

Senior Equipment EngineerThis role involves leading efforts to enhance equipment performance, reliability, and efficiency within the Wafer Finishing manufacturing process. As a Senior Equipment Engineer for Die Attach and Wire Bonding, you will be responsible for managing a team of equipment technicians, overseeing fault investigations, optimizing machine...

Senior Packaging TechnologistWe are seeking an experienced Senior Packaging Technologist to join our team.About the Role:This role is responsible for developing and enabling the deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability, and schedule requirements.Main...

We are seeking an exceptional Post-Fab Wafer Finish (PWF) Engineer to join our Advanced Packaging Technology Development team.The ideal candidate will have a strong background in semiconductor process development, preferably in wafer bonding, plating, warpage control, and packaging. They will be responsible for developing and enabling the deployment of...

Senior Researcher PositionAbout the RoleWe are seeking an experienced Senior Researcher to join our team in the field of semiconductor wafer-scale integration and advanced packaging. The successful candidate will be responsible for leading research efforts in the development of wafer-scale integrated platforms that seamlessly combine metasurface optics,...