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ULP CMOS Packaging Specialist

3 weeks ago

Singapore beBeePackaging Full time $150,000 - $200,000
Advanced Packaging Expert Role

We seek an experienced professional to lead advanced packaging process integration for ULP CMOS platforms. This role spans from early-stage process development through manufacturing transfer.

Key Responsibilities:
  • Develop and optimize process flows and recipes for defect-free, high-reliability manufacturing.
  • Lead integration of new advanced packaging features on FINFET and FDSOI platforms.
  • Coordinate device testing and ensure robust inspection & control methodologies.
  • Analyze performance, reliability, and defect data to drive improvements.
  • Freeze qualified processes and support production ramp-up.
Ideal Requirements:
  • Bachelor's degree in Electrical Engineering, Materials Science, or related field (Master's/Ph.D. preferred).
  • 8-12+ years' experience in advanced packaging, integration, R&D, NPI, or module development.
  • Strong skills in DOE, lot handling, data analysis (inline/HOL/ET).
Benefits:
  • A challenging role that offers opportunities for growth and development.
  • The chance to work with a talented team of professionals.
Additional Information:

Please forward a copy of your full CV if you would like to be considered for this opportunity. Only shortlisted candidates will be notified.