
Chief Innovation Officer
6 days ago
The NVEG NAND Product Engineering Director oversees the development, testing, and production of NAND products, ensuring they meet the highest standards of quality and performance with low cost.
Key Responsibilities:- Drive product development by defining and developing high-quality and cost-efficient NAND test strategies including wafer-level probe and backend test for the next generation NAND memory products.
- Understand 3D NAND intrinsic reliability and extrinsic defect mechanisms to develop and optimize stresses and screen solutions.
- Work with design, process development, manufacturing, and quality teams to drive technical problem-solving.
- Investigate NAND failures and develop yield improvement solutions through silicon/device characterization, design/circuit analysis, and detailed data analysis.
- Implement technical innovations to optimize test flows and reduce test time while maintaining quality and yield requirements.
- Closely work with test hardware and test engineering teams to define and secure necessary test fixtures for NAND memory testing.
- Coordinate with High Volume Manufacturing yield enhancement, DPM management, and test time reduction efforts.
- Promote innovation and drive changes to maintain the company's competitive edge.
- Provide strategic direction to the technical team, fostering a culture of innovation and continuous improvement. Routinely communicate overall product status to leadership and cross-functional product team.
- Set performance management guidelines for your engineers and leads, routinely provide guidance on career development in your team.
- Bachelor's or Master's degree in Electrical Engineering or Computer Engineering.
- At least 15 years of experience in NAND product engineering or a related field and 2-3 years of experience in a Director role.
- Proven track record of leading and managing engineering teams.
- Strong understanding of semiconductor wafer fabrication and manufacturing processes.
- Proficient in bench/lab tools for device characterization, electrical failure analysis, and fault isolation.
- Deep understanding of semiconductor memory product design, including circuitry, layout, firmware, CMOS devices, cell technology, and device physics.
- Skilled in debugging and root cause analysis for memory product design and wafer fabrication issues.
- Experienced in design-for-test methodologies, with the ability to develop targeted test algorithms and flows.
- Capable of identifying patterns and anomalies in large datasets and applying domain-specific knowledge to support issue resolution.
- Good understanding of ML/AI/Automation concepts and hands-on experience with ML/AI/Automation projects.
- Strong growth mindset, able to embrace change, challenge the status quo, and continue learning in a fast-paced environment.
- Experience with advanced memory technologies (e.g., 3D NAND, RG NAND, QLC, etc.).
- Expertise in statistical analysis and data-driven decision-making.
- Strong communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams.
- Experience with project management and the ability to manage multiple projects simultaneously.
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