Senior Package-Silicon Integration Engineer
2 months ago
Transforming the Future of Information Technology
Micron's Package Development Engineering (PDE) Group is seeking a highly skilled Senior Package-Silicon Integration Engineer to drive advanced IC package development for next generation silicon and package technologies.
Key Responsibilities:
- Collaborate with cross-functional teams to complete chip package interaction risk assessments.
- Work with scribe designers and assembly engineers to develop solutions for dicing problems and implement relevant design rules and design FMEA.
- Partner with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, improve yield, quality, and manufacturability.
- Contribute to the development of new silicon and package technologies by engaging with Micron's internal factories.
- Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process, and hand-off to manufacturing.
- Identify technology, quality, and business process gaps and develop and deploy needed solutions.
- Serve as the primary contact for Si design, scribe design, and wafer fab regarding the progress of key projects.
Requirements:
- PhD, Master's, or Bachelor's degree in Engineering (Mechanical, Materials Science, Electrical, Chemical).
- 4-5 years of work experience in the semiconductor industry, either in assembly or fab wafer fabrication.
- Strong analytical, problem-solving, and organizational skills.
- Proficiency in computer applications like Excel, Word, PowerPoint.
- Self-motivated and team-oriented.
- Strong interpersonal, oral, and written English communication skills.
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