Engineer (ATP)

4 weeks ago

Singapore DENSELIGHT SEMICONDUCTORS PTE LTD Full time
Roles & Responsibilities

Note: PLEASE READ THE JOB REQUIREMENTS CAREFULLY BEFORE MAKING THE SUBMISSION. MAKE SURE YOU QUALIFY FOR THE JOB


Duties and Responsibilities

1. Assembly & packaging process improvement & optimization.

2. Research & development of new improved manufacturing assembly concepts.

3. Documentation, maintenance and implementation of well-defined assembly processes.

4. Commissioning & evaluation of new assembly equipment.

5. Cooperate with other engineers of various disciplines towards solving complex engineering issues.

6. Review and validate product design documents to ensure compliance with current manufacturing process.


Principal Accountabilities

1) Assembly & packaging process improvement & optimization in systematic manner.

2) Taking initiative by planning improvement activities for troubleshooting process-related issues.

3) Documentation for key assembly & packaging processes and implementation of effective process control practice to achieve repeatability of quality assembly process.

4) Propose, evaluate and refine current process steps for yield and capacity improvements.

5) Carry out process FMEA, perform root cause analysis and define solution for improvements.

6) Documentation & implementation of preventive & corrective action and best-known methods to allow more efficient process troubleshooting.

7) Qualification of new assembly & packaging related direct materials.

8) Buyoff and release of new assembly & packaging equipment.

9) Ensure good housekeeping and safety practices in the work area.


Qualification Guidelines

Minimum Education

Bachelor’s Degree in Mechanical Engineering / Material Science


Minimum Experience

Minimum 5 years’ working experience with semiconductor assembly & packaging process.


Specific Knowledge / Skills

· Ideally with strong all rounded semiconductor assembly & packaging process experience & knowledge, deep understanding about processes such as wafer cleaving, die attachment (especially eutectic die attach), wire bonding, etc.

· Strong skills in developing & refining process to enhance yield, reliability & efficiency, with vast hands-on experience in DOE (design of experiment) practice.

· Strong analytical skills to identify and resolve process issues effectively, with proved experience in process/product FMEA practices and root cause analysis skills.

· Familiar with lean manufacturing principles, good knowledge in Six Sigma Methodologies (DMAIC framework) is a plus.

· Proficient in typical process control tools such as Statistical Process Control (SPC) and Pareto Analysis etc is a must.

· Ability to develop long-term strategies for process improvement & innovation.

· In-depth knowledge of materials used in semiconductor packaging and their interfaces.

· Familiarity with industry standards and regulations related to semiconductor assembly and quality control.

· Knowledge about typical analysis tools & method such as X-ray, SEM, EDX etc, commonly used in semiconductor industry.

· Ability to lead projects and work collaboratively with cross-functional teams.

· Excellent verbal & written communication skills for documentation & presentations.

· Able to mentor junior engineers and lead team in process improvement initiatives


Tell employers what skills you have

SEM
Lean Manufacturing
Quality Control
FMEA
Product Design
DMAIC
Semiconductor Industry
Root Cause Analysis
Packaging
Assembly Processes
Assembly
Process Control
Six Sigma
Commissioning
Mechanical Engineering

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