Sr. Engineer, PDE Advanced Packaging FEOL

4 weeks ago


Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time
Roles & Responsibilities

Job Responsibilities:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements for FEOL area

- Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap

- Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements

- Work with equipment suppliers to develop new capability

- Engage in active participation in Package Development Engineering activities

- Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need

- Create decision matrix for equipment and material selection

Installation and qualification of new equipment platform and handover to production group (pilot line setup)

- Plan/submit capital request to acquire new Equipment

- Create purchasing specification (Doc2) document

- Establish the new equipment qualification criteria and activities roadmap with respective functional - team

- Establish project handover requirements and procedures upon machine qualification

- Prepare documentation for handing over with respective site owner

- Conduct data gathering for low volume production

- Conduct training for Site representatives

- Feedback loop for Continuous Improvement after mass volume production

Maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

- Maintain and regularly update the TOR, with inputs from local or other assembly site

- Maintain general knowledge of process and material characteristics and translate to equipment design requirement

- Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

- Maintain knowledge of design constraints and weakness of existing platform

- Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:
- PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- Minimum 2 years’ experience in related semiconductor industry
- Experience with technical knowledge on assembly and/or wafer bumping packaging technology
- Advantage packaging technology and Front end of line background will be preferable and plus point
- Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
- Fast learner, with initiative and independence (min supervision)
- Good teammate, ability to integrate and cooperate with cross function teams and external vendors
- Strong communication and presentation skills
- Understanding of business needs and customers’ requirement
- Strong project management skills to ensure execution to timelines


Tell employers what skills you have

Management Skills
Applied Physics
Semiconductor Industry
Physics
Purchasing
Electrical
Project Management
Equipment Qualification
Packaging
Material Selection
Presentation Skills
Capital
Assembly
Benchmarking
Mechanical Engineering

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