IC Packaging Engineering ICT3

2 weeks ago

Singapore APPLE SOUTH ASIA PTE. LTD. Full time
Roles & Responsibilities

Summary


Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish


Our Hardware Technology Packaging team invents, designs, develops and integrates electronic packaging solutions for Appleʼs internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. In this highly visible role, you will own and drive sophisticated package selection, new generation product package structure and configuration optimization. You will be responsible for Package/ SIP/ module physical design and layout, optimization, DV and tape out; and work with multi-functional teams to achieve optimized mechanical/electrical/thermal performance for various types of chips.


Description


- Implement the physical design of packages and modules for SoC, Memory, RF and cellular chips.

- Interface and coordinate with multi-functional groups throughout Apple on new product

package/SiP/module feasibility analysis, design and selection.

- Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.

- Work multi-functionally to optimize package pin out.

- Perform extraction of S-parameters and package RLGC model.

- Ensure package design is optimized with SI/PI requirements.Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.

- Explore, evaluate and develop new CAD tool, design and verification flow.

- Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size


Key Qualifications


As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:


- Proven fundamentals in the electrical/material/thermal/ or mechanical engineering field(s).

- Familiarity with various sophisticated package configurations and assembly/ substrate technology (wirebond, POP, etc.).

- Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.

- Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.

- Basic knowledge of substrate manufacturing process, structure, design rules and material property.

- Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.

- Exposure to Unix environment, scripting languages (PERL, Python, TCL and or shell) and methodology.


Preferred Skills


- Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews.

- Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).

- Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.

- Solid understanding of Design Rules Check and Design for Manufacturing.


Tell employers what skills you have

RF
Allegro
Design for Manufacturing
Packaging
Cadence
Assembly
Life Sciences
WPS
IC
Physical Design
Manufacturing
Layout
Silicon
CAD
Mechanical Engineering

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